The desire in the decorative field to apply a robust PVD coating directly to the plastic substrate or a PVD layer to a primer coating without a protective coating in order to save process costs, minimize scrap, obtain a better gloss image, be able to perfectly reproduce textured plastic surfaces or realize a precoating for electroplating is often clouded by low adhesion or the mechano-chemical fragile properties of the overall system. This project demonstrated the potential of HiPIMS technology for these aspects.

The central purpose of the project was to develop a common understanding and a uniform approach for determining the product environmental footprint. In addition, a CO2 balance sheet was drawn up in practice using the example of the technical center at the Kunststoff-Institut, and recommendations for action were developed.

The project has shown that there are many individual ways to balance processes, which makes comparability difficult. In addition, benefits can be achieved through technical measures.

Due to new design concepts and simultaneous technical function integration, cases of electronic components require innovative solutions with regard to the material. Electrically conductive plastics can contribute to the trouble-free operation of electronic systems, particularly with regard to shielding against electromagnetic radiation. Technology drivers are advancing digitalization, electrification and the increase in radio applications in the automotive, electronics, household or medical sectors. Devices must function or interact side by side without unintentionally influencing each other.

On the one hand, the project dealt with material technology issues. Conductive plastics for EMC applications, based on fillers such as carbon, steel or conductive carbon black, are nowadays well established. The use of the fillers increases the stiffness of the material, but at the same time reduces important housing properties such as impact strength and elongation at break. The toughness and elongation of conductive plastics can be optimized by using modifiers. Currently unresolved is the effect on conductivity and shielding effectiveness, which are being investigated in this project.

On the other hand, the connections of case components (e.g. by screws) require special consideration with regard to the joining situation. In contrast to metallic materials, plastics exhibit increased contact resistance in the joining area, which has a detrimental effect on the shielding behavior. By choosing more suitable geometry modifications, the penetration and leakage of electromagnetic waves can be prevented. The study of the influence of geometry variation was initially performed using 3D printing. This was followed by the injection molding of cases to evaluate the influence of different materials.

The term “biocide” describes the property of a substance to prevent or reduce the emergence of bacteria, viruses or fungi. In the context of the collaborative study, the focus was on antibacterial efficacy. The growth of microbes and germs on surfaces is an undesirable effect in many respects, as it poses a hygiene risk, impairs the utility value of surfaces or leads to food spoilage.

The demand for biocide-treated surfaces has increased enormously in recent times, leading to a useful functional improvement in many products. Within the study, basic principles of antimicrobial action are shown and the possibilities of surface modification for plastics are presented. Different antimicrobial systems were researched, system suppliers were listed, the development status was scrutinizes and the application possibilities were differentiated.

As part of the joint project “Foaming in injection molding”, the properties of components produced by thermoplastic foam molding (TSG) were scrutinized as a function of material, process and process parameters.

For example, the question of the achievable degrees of foaming and how these influence the mechanical properties was answered. There were also insights into which tests and measured values correlate best with the requirements of real components and how component stresses and environmental influences affect the properties.

In the project “Overmolding of electronics”, the possibilities of encapsulating electronic components were to be further developed. Two focal points were set for this purpose. On the one hand, the aim was to validate the influence of the molding compounds and process parameters on the function of electrical components; on the other hand, the media tightness of different cable, molding compound combinations was investigated.

In the first project focus, a printed circuit board was designed which was equipped with different electronic components (electrolytic capacitors, ICs, Hall sensors, etc.). For this purpose, a measuring stand was developed with which it was possible to test the function of all components at component level. The printed circuit boards were encased in various thermoset molding compounds and molding parameters and subjected to a selection of component stresses. The function of the components was checked “fresh from the spray”, in the cooled state and after the component stresses. With many parameter settings, almost no influence on the function of the components could be determined.

For the second project focus, different cable materials were coated with the same molding compounds and process parameters. These test specimens also underwent component stressing. To determine the media tightness of the molded compound – cable combinations, the leakage rates were determined by means of pressure drop testing. Here, depending on the cable type, very high sealing densities could be determined.