APPLICATION CENTER FOR SURFACE TECHNOLOGY (AOT)
In the project “Overmolding of electronics”, the possibilities of encapsulating electronic components were to be further developed. Two focal points were set for this purpose. On the one hand, the aim was to validate the influence of the molding compounds and process parameters on the function of electrical components; on the other hand, the media tightness of different cable, molding compound combinations was investigated.
In the first project focus, a printed circuit board was designed which was equipped with different electronic components (electrolytic capacitors, ICs, Hall sensors, etc.). For this purpose, a measuring stand was developed with which it was possible to test the function of all components at component level. The printed circuit boards were encased in various thermoset molding compounds and molding parameters and subjected to a selection of component stresses. The function of the components was checked “fresh from the spray”, in the cooled state and after the component stresses. With many parameter settings, almost no influence on the function of the components could be determined.
For the second project focus, different cable materials were coated with the same molding compounds and process parameters. These test specimens also underwent component stressing. To determine the media tightness of the molded compound – cable combinations, the leakage rates were determined by means of pressure drop testing. Here, depending on the cable type, very high sealing densities could be determined.
